TI-70STI-70Shttps://www.etching-chem.com.tw/en/product_1266236.htmlTI-70S is a selective titanium etching solution based on hydrogen peroxide. It is used in semiconductor wafer packaging, high-end IC substrates, optoelectronics, passive components and other titanium or titanium-tungsten UBM layer etching processes. The syrup does not contain fluorine salt polymer and hydrofluoric acid, and the waste liquid of the process is easy to handle. It can effectively protect metals: copper, nickel, tin, tin-silver, gold, and aluminum to avoid damage to the substrate during the etching process. TI-70S can work under high temperature (25~50℃) and high PH (7~10) conditions, achieving high etching rate, low Undercut, high Bath loading and Bath life advantages.1266236
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TI-70S is a selective titanium etching solution based on hydrogen peroxide. It is used in semiconductor wafer packaging, high-end IC substrates, optoelectronics, passive components and other titanium or titanium-tungsten UBM layer etching processes. The syrup does not contain fluorine salt polymer and hydrofluoric acid, and the waste liquid of the process is easy to handle. It can effectively protect metals: copper, nickel, tin, tin-silver, gold, and aluminum to avoid damage to the substrate during the etching process. TI-70S can work under high temperature (25~50℃) and high PH (7~10) conditions, achieving high etching rate, low Undercut, high Bath loading and Bath life advantages.
TIF-50TIF-50https://www.etching-chem.com.tw/en/product_1267401.htmlIt is suitable for the etching of sputtered titanium layer on various substrates, and the etching speed is fast. The syrup does not contain hydrofluoric acid, but is replaced with a more stable fluorine salt, which causes little environmental pollution to personnel. It has significant selective etching, and has very low attack on metals on copper, nickel, tin, silver, gold and other substrates. For the large carrying capacity of dissolved metals, it can be used with acid equivalent control and TIF-50R can be added. 1267401
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It is suitable for the etching of sputtered titanium layer on various substrates, and the etching speed is fast. The syrup does not contain hydrofluoric acid, but is replaced with a more stable fluorine salt, which causes little environmental pollution to personnel. It has significant selective etching, and has very low attack on metals on copper, nickel, tin, silver, gold and other substrates. For the large carrying capacity of dissolved metals, it can be used with acid equivalent control and TIF-50R can be added.
TIF-50NTIF-50Nhttps://www.etching-chem.com.tw/en/product_1399012.htmlTIF-50N titanium etching solution is suitable for the titanium etching process with a thickness of more than micrometers, and the etching speed is fast and uniform. The syrup is stable and does not contain hydrofluoric acid, which causes little environmental pollution to personnel. Large load capacity for dissolved metals.1399012
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TIF-50N titanium etching solution is suitable for the titanium etching process with a thickness of more than micrometers, and the etching speed is fast and uniform. The syrup is stable and does not contain hydrofluoric acid, which causes little environmental pollution to personnel. Large load capacity for dissolved metals.
CU-100CU-100https://www.etching-chem.com.tw/en/product_1269143.html・ The UBM layer etching process of copper used in wafer-level packaging, and has a high selection ratio for other metals and substrates, such as: Au, Sn, SnAg, Ni, Al, Polyimide, Glass, SiO2.・ After the etching, the side etching amount and undercut of the electroplated copper circuit are small, which is suitable for the fine pitch process.・ Stable etch rate and long bath life.1269143
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・ The UBM layer etching process of copper used in wafer-level packaging, and has a high selection ratio for other metals and substrates, such as: Au, Sn, SnAg, Ni, Al, Polyimide, Glass, SiO2.・ After the etching, the side etching amount and undercut of the electroplated copper circuit are small, which is suitable for the fine pitch process.・ Stable etch rate and long bath life.
CU-730ACU-730Ahttps://www.etching-chem.com.tw/en/product_1443737.htmlCU-730A uses a sulfuric acid hydrogen peroxide system. This product contains accelerators, which can increase the etching rate to 6-9μm/min and improve the efficiency of the production line. At the same time, stabilizers and shore protection agents are added. The stabilizer can effectively inhibit the cleavage of hydrogen peroxide and maintain the stability of the etching solution; the bank protection agent is an organic additive that can form a film on the weaker sides of the water flow to reduce the attack of the potion. This kind of low solubility protective film has a big difference under different pressures. It is easy to break when the pressure is high, but it is not easy to break on both sides of the low pressure. It can effectively reduce the amount of side erosion by 20~30%; In the case of positive etching and reduced side etching, the etching quality of fine lines is better.◆ Use sulfuric acid/hydrogen peroxide system, stable bite corrosion rate◆ Add stabilizer to effectively inhibit the pyrolysis of hydrogen peroxide and maintain the stability of the etching solution◆ Add special revetment agent to effectively reduce the amount of side erosion.◆ It can be used with copper sulfate recovery machine to extend the life of the tank liquid and meet the demand for waste reduction◆ No chlorine, no toxic chlorine is generated during recycling, meeting environmental protection requirements◆ Effectively improve etching accuracy and quality1443737
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CU-730A uses a sulfuric acid hydrogen peroxide system. This product contains accelerators, which can increase the etching rate to 6-9μm/min and improve the efficiency of the production line. At the same time, stabilizers and shore protection agents are added. The stabilizer can effectively inhibit the cleavage of hydrogen peroxide and maintain the stability of the etching solution; the bank protection agent is an organic additive that can form a film on the weaker sides of the water flow to reduce the attack of the potion. This kind of low solubility protective film has a big difference under different pressures. It is easy to break when the pressure is high, but it is not easy to break on both sides of the low pressure. It can effectively reduce the amount of side erosion by 20~30%; In the case of positive etching and reduced side etching, the etching quality of fine lines is better.◆ Use sulfuric acid/hydrogen peroxide system, stable bite corrosion rate◆ Add stabilizer to effectively inhibit the pyrolysis of hydrogen peroxide and maintain the stability of the etching solution◆ Add special revetment agent to effectively reduce the amount of side erosion.◆ It can be used with copper sulfate recovery machine to extend the life of the tank liquid and meet the demand for waste reduction◆ No chlorine, no toxic chlorine is generated during recycling, meeting environmental protection requirements◆ Effectively improve etching accuracy and quality
CU-845WCU-845Whttps://www.etching-chem.com.tw/en/product_1399007.htmlCU-845W is a selective copper etching solution based on hydrogen peroxide and organic acid. It is used in semiconductor wafer packaging, high-end IC substrate, photoelectric industry, passive components and other UBM sputtering copper layer etching process. For other metals with a high degree of selection ratio, such as: Ti, Ni, Sn/SnAg, Au, Al, and suitable for the manufacture of silicon wafers, gallium arsenide wafers and other different fields. After etching, the amount of side etching and undercut of the electroplated copper circuit is less, which is suitable for the fine pitch process. The etching rate is stable and the Bath Life is long.1399007
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CU-845W is a selective copper etching solution based on hydrogen peroxide and organic acid. It is used in semiconductor wafer packaging, high-end IC substrate, photoelectric industry, passive components and other UBM sputtering copper layer etching process. For other metals with a high degree of selection ratio, such as: Ti, Ni, Sn/SnAg, Au, Al, and suitable for the manufacture of silicon wafers, gallium arsenide wafers and other different fields. After etching, the amount of side etching and undercut of the electroplated copper circuit is less, which is suitable for the fine pitch process. The etching rate is stable and the Bath Life is long.
SPS-40HSPS-40Hhttps://www.etching-chem.com.tw/en/product_1399011.htmlSPS-40H is a persulfate type microetching fluid specially developed for copper surface cleaning. It is mainly used to increase the surface roughness of copper. The main components are sodium persulfate, water-soluble penetrant, accelerator, etc., which have better roughness and uniformity than sodium persulfate solution for the micro-etching effect on the copper surface.・No interference from chloride ions.・Reduce the number of slots and save running-cost.・It can reduce the pyrolysis rate of persulfate dissolved in water, and give full play to the persulfate micro-corrosion ability, and the micro-corrosion rate is stable.・Can be used for horizontal spraying (SPRAY) or vertical immersion (DIP) operating systems.1399011
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SPS-40H is a persulfate type microetching fluid specially developed for copper surface cleaning. It is mainly used to increase the surface roughness of copper. The main components are sodium persulfate, water-soluble penetrant, accelerator, etc., which have better roughness and uniformity than sodium persulfate solution for the micro-etching effect on the copper surface.・No interference from chloride ions.・Reduce the number of slots and save running-cost.・It can reduce the pyrolysis rate of persulfate dissolved in water, and give full play to the persulfate micro-corrosion ability, and the micro-corrosion rate is stable.・Can be used for horizontal spraying (SPRAY) or vertical immersion (DIP) operating systems.
NiCr-537NiCr-537https://www.etching-chem.com.tw/en/product_1268846.html1.Does not hurt copper, silver and other metals.2.The catalyst is not easy to crack, can maintain a stable etching rate, and has good stability to temperature.3.The copper layer line has low side etching and is suitable for the Fine Line process.4.Bath Life is long and can be replenished to manage bath fluids.1268846
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1.Does not hurt copper, silver and other metals.2.The catalyst is not easy to crack, can maintain a stable etching rate, and has good stability to temperature.3.The copper layer line has low side etching and is suitable for the Fine Line process.4.Bath Life is long and can be replenished to manage bath fluids.
NI-545NI-545https://www.etching-chem.com.tw/en/product_1399009.htmlNI-545 nickel etching solution is a product dedicated to the removal of electroplated nickel plating, which is RoHS compliant and does not contain harmful substances. While removing the nickel plating layer, by adding a special protective agent, it can effectively protect the electroplated copper , copper alloy and other metals of the substrate from corrosion. It can be widely used in stripping various electroplated nickel plating. Stable bite corrosion rate, good stability to temperature. Effectively inhibit the decomposition of hydrogen peroxide and maintain the stability of the etching solution. Add special protective agent to effectively reduce the amount of copper biting. Does not bite and corrode stainless steel.1399009
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NI-545 nickel etching solution is a product dedicated to the removal of electroplated nickel plating, which is RoHS compliant and does not contain harmful substances. While removing the nickel plating layer, by adding a special protective agent, it can effectively protect the electroplated copper , copper alloy and other metals of the substrate from corrosion. It can be widely used in stripping various electroplated nickel plating. Stable bite corrosion rate, good stability to temperature. Effectively inhibit the decomposition of hydrogen peroxide and maintain the stability of the etching solution. Add special protective agent to effectively reduce the amount of copper biting. Does not bite and corrode stainless steel.
NiCr-50SNiCr-50Shttps://www.etching-chem.com.tw/en/product_1399010.htmlNiCr-50S uses a mixed acid system with a relatively stable etching rate, which can effectively control the etching amount and improve the etching accuracy. This product especially contains a protective agent, which can effectively form a water-based coating film on the conductive layer (copper, silver... etc.) and reduce the corrosion of copper and silver during the etching process. The protective agent is extremely hydrophilic, and it can be easily removed by rinsing with clean water after etching, without affecting the subsequent manufacturing process.1. Does not damage other metals such as copper and silver.2. The catalyst is not easy to crack, can maintain a stable etching rate, and has good stability to temperature.3. Low side corrosion of copper layer lines.1399010
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NiCr-50S uses a mixed acid system with a relatively stable etching rate, which can effectively control the etching amount and improve the etching accuracy. This product especially contains a protective agent, which can effectively form a water-based coating film on the conductive layer (copper, silver... etc.) and reduce the corrosion of copper and silver during the etching process. The protective agent is extremely hydrophilic, and it can be easily removed by rinsing with clean water after etching, without affecting the subsequent manufacturing process.1. Does not damage other metals such as copper and silver.2. The catalyst is not easy to crack, can maintain a stable etching rate, and has good stability to temperature.3. Low side corrosion of copper layer lines.
AL-102AL-102https://www.etching-chem.com.tw/en/product_1399005.htmlThis product can be used for surface treatment of aluminum and aluminum alloys, which can remove the oxide layer generated on the surface and provide a fresh aluminum metal surface to facilitate subsequent plating and adhesion. The special addition of copper protection agent can inhibit the rate of copper being etched, increase the etching difference ratio between aluminum and copper, and achieve the effect of aluminum etching without damaging copper.1399005
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This product can be used for surface treatment of aluminum and aluminum alloys, which can remove the oxide layer generated on the surface and provide a fresh aluminum metal surface to facilitate subsequent plating and adhesion. The special addition of copper protection agent can inhibit the rate of copper being etched, increase the etching difference ratio between aluminum and copper, and achieve the effect of aluminum etching without damaging copper.
AL-104AL-104https://www.etching-chem.com.tw/en/product_1399006.htmlAL-104 is an aluminum etching solution based on hydrochloric acid. This product can be used for etching and forming aluminum and aluminum alloys. It can quickly etch aluminum with low side etching and does not damage dry or wet films or cover ink.1399006
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AL-104 is an aluminum etching solution based on hydrochloric acid. This product can be used for etching and forming aluminum and aluminum alloys. It can quickly etch aluminum with low side etching and does not damage dry or wet films or cover ink.
