TI-70S is a selective titanium etching solution based on hydrogen peroxide. It is used in semiconductor wafer packaging, high-end IC substrates, optoelectronics, passive components and other titanium or titanium-tungsten UBM layer etching processes. The syrup does not contain fluorine salt polymer and hydrofluoric acid, and the waste liquid of the process is easy to handle. It can effectively protect metals: copper, nickel, tin, tin-silver, gold, and aluminum to avoid damage to the substrate during the etching process. TI-70S can work under high temperature (25~50℃) and high PH (7~10) conditions, achieving high etching rate, low Undercut, high Bath loading and Bath life advantages.
1266236
