Selective Titanium Etchant (H2O2)

TI-70S is a hydrogen-based selective titanium etching solution. It does not contain fluorine and hydrofluoric acid, and has a low impact on the environment.
UBM layer etching process of Ti or TiW used in wafer-level packaging, and has a high selection ratio for other metals and substrates, such as: Cu, Al, Ni, Au, Sn, SnAg, Polyimide, Glass, SiO2.
TI-70S can be used in high temperature and high PH operating conditions, it can achieve a more efficient etching rate, and the bath life is longer.
Etching rate and stability can be maintained under the same operation with copper electroplating.
Etching Chemical 1266236