蝕刻液、剝膜液、前後處理液、晶圓清洗液、雷射保護劑

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DSN-203
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DSN-20

Development-Stripper Neutralizing Solution

Generally after the development, some K or Na inorganic alkalis will remain on the copper surface, causing contamination of the copper surface. In severe cases, it will cause poor development, and it will also easily cause blockage of the nozzle or tank wall crystal and filtration system. As long as it has a small concentration, it can clean inorganic copper, magnesium, potassium, sodium and other metals or ash parts, and effectively increase the copper surface's activity and anticorrosive function. 1266239