CU-100

Selective Copper Etchant

・ The UBM layer etching process of copper used in wafer-level packaging, and has a high selection ratio for other metals and substrates, such as: Au, Sn, SnAg, Ni, Al, Polyimide, Glass, SiO2.
・ After the etching, the side etching amount and undercut of the electroplated copper circuit are small, which is suitable for the fine pitch process.
・ Stable etch rate and long bath life.