DS-343M
Remover
The stripping solution DS-343M can be used alone or added to the general sodium hydroxide or potassium hydroxide stripping solution. It can promote the cracking and stripping of the dry film, and the film residue can be easily removed after stripping. The surface cleanliness is better than traditional stripping fluids, and can be applied to a variety of different production lines such as wafers, PCBs, ceramic substrates, and passive components. This product can be used to determine the concentration and time of use according to the film thickness.
・The dry film stripping characteristics of thin lines (10~100μm) are improved, and the DFR after stripping is made finer.
・Without DMSO, TMAH, NMP, the peelability of thick film DFR is improved.
・The amount of corrosion to metals (Cu, Ni, Sn, Ti) is small, and the applicability to device substrates is excellent.