蝕刻液、剝膜液、前後處理液、晶圓清洗液、雷射保護劑

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AF-0023
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AF-002

Defoamer

In the PCB manufacturing process, the saponification of the resin (ink, dry film) during development or film removal causes blistering, causing the pump to inhale too many bubbles, resulting in pressure instability that affects the stability of the process, resulting in For many problems such as improper development or improper film removal, this product can provide good defoaming and foam suppression functions. 1398998