蝕刻液、剝膜液、前後處理液、晶圓清洗液、雷射保護劑

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CPC-103
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CPC-10

Cleaning fluid after grinding

CPC-10 is an organic amine-based post-polishing cleaning fluid. It can be used in semiconductor manufacturing processes to remove copper inhibitor complexes, metal ions, and organic compounds remaining on the wafer, as well as excellent copper corrosion resistance, and can maintain copper The flatness of the surface. Wafer Cleaner 1399003