CU-845W

CU-845W is a selective copper etching solution based on hydrogen peroxide and organic acid. It is used in semiconductor wafer packaging, high-end IC substrate, photoelectric industry, passive components and other UBM sputtering copper layer etching process. For other metals with a high degree of selection ratio, such as: Ti, Ni, Sn/SnAg, Au, Al, and suitable for the manufacture of silicon wafers, gallium arsenide wafers and other different fields. After etching, the amount of side etching and undercut of the electroplated copper circuit is less, which is suitable for the fine pitch process. The etching rate is stable and the Bath Life is long.