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CU-730A3
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CU-730A

High-speed copper etching solution

CU-730A uses a sulfuric acid hydrogen peroxide system. This product contains accelerators, which can increase the etching rate to 6-9μm/min and improve the efficiency of the production line. At the same time, stabilizers and shore protection agents are added. The stabilizer can effectively inhibit the cleavage of hydrogen peroxide and maintain the stability of the etching solution; the bank protection agent is an organic additive that can form a film on the weaker sides of the water flow to reduce the attack of the potion. This kind of low solubility protective film has a big difference under different pressures. It is easy to break when the pressure is high, but it is not easy to break on both sides of the low pressure. It can effectively reduce the amount of side erosion by 20~30%; In the case of positive etching and reduced side etching, the etching quality of fine lines is better.
◆ Use sulfuric acid/hydrogen peroxide system, stable bite corrosion rate
◆ Add stabilizer to effectively inhibit the pyrolysis of hydrogen peroxide and maintain the stability of the etching solution
◆ Add special revetment agent to effectively reduce the amount of side erosion.
◆ It can be used with copper sulfate recovery machine to extend the life of the tank liquid and meet the demand for waste reduction
◆ No chlorine, no toxic chlorine is generated during recycling, meeting environmental protection requirements
◆ Effectively improve etching accuracy and quality
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